Empowering Indian businesses in the procurement ecosystem since 2012
| Tender ID | 3034022 |
|---|---|
| Organisation Name | Department Of Defence Production |
| Tender Brief | Bid To RAs Bid To RAs Corrigendum : Supply Of 03 Si Full Wafer 1. 4 Mm , 03 Si Full Wafer With 4 Different Type Of Laser Combinations , 03 Si Full Wafer And 2 Si Wafer With 3 Mm Thickness , 02 Si Wafer With 3mm Thickness With Minimum 4 Different Type Of Laser Characterization As Per Scope Of Work , 06 Si Full Wafer |
| Last Date For Submission | 23rd Jun, 2026 |
| Opening Date | Refer to Documents |
| Document Cost | 0.00 |
|---|---|
| EMD | 0.00 |
| Estimated Cost | 0.00 |
| City | Delhi |
|---|---|
| State | Delhi |
Ending Today