Empowering Indian businesses in the procurement ecosystem since 2012
| Tender ID | 5873514 |
|---|---|
| Organisation Name | Indian Institute Of Technology |
| Tender Brief | Supply Of Die Bonder And Wedge And Ball Bonder Quantity: 1 |
| Last Date For Submission | 20th Oct, 2026 |
| Opening Date | Refer to Documents |
| Document Cost | 0.00 |
|---|---|
| EMD | 168000.00 |
| Estimated Cost | 0.00 |
| City | Gandhinagar |
|---|---|
| State | Gujarat |
20 Days Left