Empowering Indian businesses in the procurement ecosystem since 2012
| Tender ID | 5086026 |
|---|---|
| Organisation Name | Defence Research And Development Organisation |
| Tender Brief | Flip Chip Bonding At Cmti |
| Last Date For Submission | 10th Aug, 2026 |
| Opening Date | 11 Aug, 2026 |
| Document Cost | 0.00 |
|---|---|
| EMD | 103500.00 |
| Estimated Cost | 0.00 |
| City | Lucknow |
|---|---|
| State | Uttar Pradesh |
16 Days Left