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| Tender ID | 3980240 |
|---|---|
| Organisation Name | Defence Research And Development Organisation |
| Tender Brief | Photolithography, Indium Deposition And Optimization Of Flip Chip Bonding |
| Last Date For Submission | 23rd Apr, 2026 |
| Opening Date | 24 Apr, 2026 |
| Document Cost | 0.00 |
|---|---|
| EMD | 696200.00 |
| Estimated Cost | 0.00 |
| City | Lucknow |
|---|---|
| State | Uttar Pradesh |
12 Days Left