Empowering Indian businesses in the procurement ecosystem since 2012
| Tender ID | 3094152 |
|---|---|
| Organisation Name | Indian Army |
| Tender Brief | Corrigendum : Supply Of Bond Polymer Refine Detection Part No Ds9800 , Bond Wash Solution 10x 1l Part No Ar 9590 , Bond Slide Label Print Ribbon Part No S21 4564 , Bond Dab Mixing Stations Part No S21 1971 , Bond Open Containers 7ml Part No Op79193 , Bond Titration Kit Part No Opt9049 , Bond Universal Cover Tiles Pack Of 100 Part No S21 2001 , Bond Dewax Solution Part No Ar9222 , Bond Epitope Retrieval 1 1ltr Part No Ar9961 , Bond Epitope Retrieval 2 1 Ltr Part No Ar9640 , Leica Microsystems Plus Slides Part No S21 2113 A , Bond Aspirating Probe Part No S21 0605 |
| Last Date For Submission | 28th Feb, 2026 |
| Opening Date | Refer to Documents |
| Document Cost | 0.00 |
|---|---|
| EMD | 0.00 |
| Estimated Cost | 4929765.36 |
| City | Pune |
|---|---|
| State | Maharashtra |
Closed